本文研究了热电薄膜粘合到弹性基底结构的屈曲行为．将界面剪切应力和薄膜的轴向应力结合起来，建立了热电薄膜的计算模型，利用边界条件将所求问题转化为一个奇异积分方程．通过使用切比雪夫多项式展开求解奇异积分方程，得到归一化应力强度因子．确定了膜厚度和基材与膜刚度比对薄膜应力和界面应力强度因子的影响．讨论了薄膜长度和厚度比对薄膜应力和界面应力强度因子的影响．结果显示薄膜和基底之间的刚度比对薄膜的应力水平有着较明显的影响．

In this paper, the buckling behavior of thermoelectric thin film bonded to elastic substrates is studied. Combining the interface shear stress with the axial stress of the thin film, the calculation model of the thermoelectric thin film is established and the problem is transformed into a singular integral equation by using boundary conditions. The singular integral equation is separated by using Chebyshev polynomials, and the normalized stress intensity factors are obtained. The effects of film stress and interfacial stress intensity factors are determined by the film thickness and the stiffness ratio of substrate to film. The influence of the film length and the thickness ratio on film stress and interface stress intensity factors is discussed. The result shows that the stiffness ratio between the film and the substrate has a significant effect on the stress level of the film.